The Quality Test of Wire Bonding
نویسندگان
چکیده
منابع مشابه
The Quality Test of Wire Bonding
The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between t...
متن کاملWire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
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The real-time monitoring of an industrial ball bonding process is reported using a new type of test chips with custom-made integrated sensors (microsensors). These sensors were fabricated using a commercial double-metal CMOS process [1]. Two types of integrated monitors are reported, a temperature [2] and an ultrasound shear force sensor [3]. The temperature sensor uses the thermoelectric prope...
متن کاملOverview of wire bonding using copper wire or insulated wire
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
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ژورنال
عنوان ژورنال: Modern Applied Science
سال: 2009
ISSN: 1913-1852,1913-1844
DOI: 10.5539/mas.v3n12p50